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Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

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Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

Brand Name : Hanast

Model Number : HN-5508AB

Certification : MSDS

Place of Origin : CHINA

MOQ : 1KG

Price : 6.1

Payment Terms : T/T

Supply Ability : 1000000KG

Delivery Time : 3-5 work days

Packaging Details : Plastic/Iron Drums

Product name : Epoxy Resin potting glue

Color : Black/Grey/Transparent color, can customized

Application : PCB/Battery/LED

Package : 5kgs/25kgs/200kgs/bag

Material : Epoxy Resin&Agent

Keywords : Waterproof Sealant

Viscosity : Excellent Viscosity

Certificate : MSDS RoHS UL

Feature : Low and high Temperature Resistance

Thermal conductivity : Customize

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5:1 Electronic Epoxy Potting Glue Waterproof Sealing Insulation For Power Module Circuit Board Electrical Sealant for Transformers Resistors Filters Electronic Appliances

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
Surface A sticky epoxy resin water r liquid specific
specific gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
storage Period (25℃) Six months x months
processabilility mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing Tensile strength of kg/cm 16-18
Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm 14
1.2*10
Volume resistance ofΩ-cm 15
1.1*10
contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%
The hardness of SHORE A 85-95
Distortion temperature ℃ 130-150
low temperature resistant ℃ -30

Product Overview
HN-5508 is an epoxy potting compound designed for the electronics and electrical industry. It has low viscosity, high insulation and temperature resistance, and is suitable for potting and protection of electronic components such as transformers, resistors, filters, etc.

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

Core advantages
High insulation: volume resistivity 1.1×10¹⁵ Ω·cm, withstand voltage strength 20-22 kV/mm.

Temperature resistance: operating temperature range -30°C to 130-150°C, suitable for high temperature environment.

Fast curing: 12-16 hours at 25°C for full curing, or 1.5-2 hours at 60-80°C for curing.

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

Application areas


Product Tags:

Sealing thermally conductive epoxy potting compound

      

thermally conductive epoxy potting compound liquid

      

Epoxy liquid clear silicone

      
Quality Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone for sale

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