HN-5508 Epoxy Resin Potting Glue
Product Specification
| Before curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface |
| Surface | A sticky epoxy resin water | r liquid specific |
| specific gravity, g / cm3 | 1.4-1.5 | 1.05 |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage |
| storage Period (25℃) | Six months | x months |
| processabilility | mixing ratio | A: B =5:1 (weight ratio) |
| Available for a time of 25℃ | 2-3H (100g mix) |
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing | Tensile strength of kg/cm | 16-18 |
| Compressive strength of kg/cm | 18-22 |
| Resistance to the voltage of kv/mm | 20-22 |
| Surface resistance ofΩ-cm | 14 |
| 1.2*10 |
| Volume resistance ofΩ-cm | 15 |
| 1.1*10 |
| contraction percentage% | 0.35-0.55 |
| Water absorption rate was 25℃ * 24H | <0.03% |
| The hardness of SHORE A | 85-95 |
| Distortion temperature ℃ | 130-150 |
| low temperature resistant ℃ | -30 |
Product Overview
HN-5508 is a two-component epoxy potting compound designed for room-temperature or low-temperature curing. With low viscosity, extended work time, and excellent fluidity, it penetrates easily into product gaps. After curing, it forms a bubble-free, smooth, and glossy surface with high hardness. The cured material exhibits outstanding resistance to acids, alkalis, moisture, and aging, along with superior electrical insulation, voltage resistance, and bonding strength. Ideal for electronic components requiring encapsulation, insulation, and environmental protection.
Product Features
Low viscosity: easy to penetrate into the gap of the product to ensure complete potting.
High hardness: the surface is smooth after curing, with high hardness, providing excellent mechanical protection.
Chemical resistance: acid and alkali resistance, moisture resistance, aging resistance, suitable for harsh environments.
Excellent electrical properties: high insulation, pressure resistance and bonding strength.
Application areas
Electronic appliances: transformers, resistors, filters, temperature sensors, etc.
Industrial equipment: high voltage packaging, aquarium equipment, ultrasonic atomizers, etc.
Others: components that require insulation, flame retardancy and temperature resistance.
Usage
Mix in a weight ratio of A:B = 5:1.
Operation time at 25℃ is 2-3 hours, surface curing in 6-8 hours, and full curing in 12-16 hours; or curing in 1.5-2 hours at 60-80℃.
Packing specifications
30 KG/group (A component 25 KG/barrel, B component 5 KG/can)
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25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components Images
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