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Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

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Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Brand Name : Hanast

Model Number : HN-5508AB

Certification : MSDS

Place of Origin : CHINA

MOQ : 1KG

Price : 6.3

Payment Terms : T/T

Supply Ability : 1000000KG

Delivery Time : 3-5 work days

Packaging Details : Plastic/Iron Drums

Product name : Epoxy Resin potting glue

Color : Black/Grey/Transparent color, can customized

Application : PCB/Battery/LED

Package : 5kgs/25kgs/200kgs/bag

Material : Epoxy Resin&Agent

Keywords : Waterproof Sealant

Viscosity : Excellent Viscosity

Certificate : MSDS RoHS UL

Feature : Low and high Temperature Resistance

Thermal conductivity : Customize

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Two-component Epoxy Potting Sealant Moisture-proof Fire Retardant High Temp Conductive Glue for Transformers Resistors Filters Electronic Appliances

HN-5508 Industrial Epoxy Resin Potting Glue

Product Specification

Before curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
Surface A sticky epoxy resin water r liquid specific
specific gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
storage Period (25) Six months x months
processabilility mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing Tensile strength of kg/cm 16-18
Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm 14
1.2*10
Volume resistance ofΩ-cm 15
1.1*10
contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%
The hardness of SHORE A 85-95
Distortion temperature 130-150
low temperature resistant -30

Product Describtion
HN-5508 is a two-component epoxy potting compound designed for room-temperature or low-temperature curing. With low viscosity, extended work time, and excellent fluidity, it penetrates easily into product gaps. After curing, it forms a bubble-free, smooth, and glossy surface with high hardness. The cured material exhibits outstanding resistance to acids, alkalis, moisture, and aging, along with superior electrical insulation, voltage resistance, and bonding strength. Ideal for electronic components requiring encapsulation, insulation, and environmental protection.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Product Advantage
Reliable Protection: Shields against moisture, vibration, and thermal stress.
Versatile: Adapts to diverse electronic and industrial applications.
Cost-Effective: Long pot life reduces waste during processing.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Technical parameters
Viscosity (Component A: 4500-6000 cps, Component B: 150-250 cps)

Hardness (SHORE D): 85-95

Tensile strength: 16-18 kg/cm²

Compressive strength: 18-22 kg/cm²

Application scenarios
High-voltage packaging: used for insulation and protection of high-voltage equipment.

Aquarium equipment: Provide waterproof and moisture-proof sealing.

Ultrasonic atomizer: Enhance the durability and reliability of equipment.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Usage method
Mix according to the weight ratio of A:B = 5:1 and use.

Fully cure in 12-16 hours at 25℃, or 1.5-2 hours at 60-80℃.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Packing specifications
30 KG/group (Component A 25 KG/barrel, Component B 5 KG/can)

Contact Us for samples or customized solutions!


Product Tags:

Two Component Epoxy Potting Compound

      

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Moistureproof low viscosity potting compound

      
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